TRICONEX TRICON 4409 SMM

Interconnect Assemblies
Trident baseplates within a single I/O
column are connected by Interconnect
Assemblies that carry I/O messages and
logic power across the baseplates. The
MP Interconnect is connected to an I/O
baseplate, and the I/O Interconnects are
connected to other I/O Baseplates.
MP Interconnect Assembly
Physically, an MP Interconnect
Assembly consists of a small passive
PCB in a molded plastic housing with
two DIN-C 96-pin male connectors.
The assembly is attached to the top or
bottom of an MP Baseplate in order to
connect adjacent I/O Baseplates. The
MP Interconnect Assembly also is used
on AI and AO HART Baseplates
because they are the same size as MP
Baseplates.
I/O Interconnect Assembly
Physically, an I/O Interconnect
Assembly consists of a small passive
PCB in a molded plastic housing with
two DIN-C 96-pin male connectors.
The assembly is attached to the top or
bottom of an I/O baseplate in order to
connect other I/O Baseplates.
Required Accessories
The following accessories are required
to protect Trident components from
dust, liquids and corrosive atmospheres:
• End caps
• Terminal covers
• Slot covers
End caps protect the top and bottom of
each end-of-column baseplate and
serve as a card guide. They are available
for both MP Baseplates and I/O Baseplates.
Terminal covers protect any terminals
on a baseplate that are not connected to
field wiring.
Slot covers protect unused baseplate
slots.