TRICONEX TRICON 5451 Solid-State Relay Output TriPak 1

Main products, advantageous supply, and sufficient inventory
Foxboro: I/A Series system, FBM full series (field input/output modules)
Sequential control, trapezoidal logic control, accident memory processing, analog-to-digital conversion, input/output signal processing
Data communication and processing, etc.
Westinghouse: 1C31 series DCS system, CPU, OVATION system, WDPF system
WEStation system spare parts.
Triconex: Redundant fault-tolerant control system, the most modern fault-tolerant controller based on Triple Modular Redundancy (TMR) structure.
Emerson: Various spare parts such as modules, cards, drives, etc.
XYCOM: XVME series
Bently: 3500/3300 system.
Rockwell: ICS system.
ABB: PM full series DCS system, IGCT high-voltage frequency converter series, industrial robot spare parts DSQC series, INFI 90, etc.
Bailey: BRC series DCS system, etc.
Allen Bradley: 1756, 1785, 1771, 1746 full series systems, etc.
Yokogawa: CP series, etc.
Honeywell: TK/TC/CC systems, etc.
Reliance: 57C series, etc.
Schneider: 140 series processors, control cards, power modules, etc.
Modicon: AS series PLC system spare parts.
Siemens: 6ES5/6ES7414/6ES7415/6ES7416 series PLC system spare parts
Siemens MOORE, Siemens Simatic C1, Siemens CNC system, etc.
Motorola: MVME 162, MVME 167, MVME1772, MVME177
Waiting series.
XYCOM: I/O, VME board, and processor, etc.
GE (General Electric): IC698/IC697 full series of PLC systems, modules, cards, drives and other spare parts.
Yaskawa: servo controller, servo motor, servo driver.
Bosch Rexroth: Indramat, I/O modules, PLC controllers, drive modules, etc.
Woodward: SPC valve position controller, PEAK150 digital controller.

Interconnect Assemblies
Trident baseplates within a single I/O
column are connected by Interconnect
Assemblies that carry I/O messages and
logic power across the baseplates. The
MP Interconnect is connected to an I/O
baseplate, and the I/O Interconnects are
connected to other I/O Baseplates.
MP Interconnect Assembly
Physically, an MP Interconnect
Assembly consists of a small passive
PCB in a molded plastic housing with
two DIN-C 96-pin male connectors.
The assembly is attached to the top or
bottom of an MP Baseplate in order to
connect adjacent I/O Baseplates. The
MP Interconnect Assembly also is used
on AI and AO HART Baseplates
because they are the same size as MP
Baseplates.
I/O Interconnect Assembly
Physically, an I/O Interconnect
Assembly consists of a small passive
PCB in a molded plastic housing with
two DIN-C 96-pin male connectors.
The assembly is attached to the top or
bottom of an I/O baseplate in order to
connect other I/O Baseplates.
Required Accessories
The following accessories are required
to protect Trident components from
dust, liquids and corrosive atmospheres:
• End caps
• Terminal covers
• Slot covers
End caps protect the top and bottom of
each end-of-column baseplate and
serve as a card guide. They are available
for both MP Baseplates and I/O Baseplates.
Terminal covers protect any terminals
on a baseplate that are not connected to
field wiring.
Slot covers protect unused baseplate
slots.