Basic Information

Brand: Applied Materials (AMAT)

Model: 0010-32695

Full Name: Heater Assembly

Applicable Specifications: 300mm (12 inches) wafers

Applicable Equipment: AMAT Producer SE / Producer GT series processing platforms, commonly used for PVD, metallization, barrier layer deposition chambers

Core Parameters

Temperature Range: Room temperature to 500°C, commonly used range 150–420°C

Temperature Control Precision: ±0.8°C, uniform temperature across the entire wafer ≤±1.8°C

Heating Power: Rated approximately 4.2kW, built-in multi-zone heating circuit

Structural Material: Surface high-purity alumina ceramic base, internal nickel-chromium heating element + armored thermocouple, body aluminum alloy + stainless steel, integrated water cooling circuit and vacuum sealing structure

Working Environment: High vacuum conditions, resistant to plasma and conventional process corrosive gases

Overall Weight: Approximately 29.5kg

Main Functions

As the core component for holding and heating 300mm wafers, it places and heats the wafers; combined with thermocouples to achieve temperature closed-loop control, ensuring uniform film deposition thickness and resistance; integrated water cooling system for rapid temperature change and thermal stability, suitable for continuous production conditions.

Weakest Points & Maintenance Suggestions

Common Faults: Ceramic disc surface scratches, deposits, micro cracks; heating circuit resistance abnormalities, broken wires; thermocouple reading drift; water cooling pipeline leakage, aging of sealing components.

Maintenance: Regular plasma / wet cleaning of the disc surface; perform temperature calibration every 1 year; if there is porcelain surface damage, heating failure, or leakage, the entire set needs to be replaced.

Application field
Heat treatment of semiconductor wafers
Monitor the temperature distribution of high-temperature processes such as annealing, oxidation and diffusion.
Cooperate with the PMAX transmitter
Achieve high-precision thermal radiation management to enhance process stability and product yield.