AMAT 0010-09341 Wafer Lift Assembly (Wafer Elevator Component)

0010-09341 is the core original equipment component of Applied Materials' (AMAT) Precision 5000 (P5000) semiconductor wafer processing platform. Its full name is Wafer Lift Assembly, and it is used for the precise lifting and positioning of wafers inside CVD/etching chambers. 

I. Basic Information

Manufacturer: Applied Materials (AMAT, USA)

Component Model: 0010-09341 (Common Revision C)

Compatible Platform: P5000 (Precision 5000) series CVD / etching systems

Core Function: 

Lift up / push the wafer in the vacuum chamber, and cooperate with the mechanical hand to complete wafer transfer, alignment and process positioning

Application Scenario: Deposition (CVD), etching, heat treatment and other front-end processes for 8-inch (200mm) wafers

P5000 Platform Positioning

P5000 is AMAT's classic single-chamber/multi-chamber cluster wafer processing platform, focusing on PECVD, LPCVD, RIE and other processes for 200mm wafers. It features high vacuum, high-precision temperature control, and multi-chamber parallel capabilities. It is widely used in the manufacturing of logic/storage chips, power devices, photovoltaics, etc. 

 Component Core Parameters

Dimensions: Approximately 400×400×400mm (16″×16″×16″)

Weight: Approximately 9kg (20lbs)

Drive Method: Precision stepper motor + ball screw, micron-level elevation accuracy

Compatible Wafers: 200mm (8 inches), compatible with standard vacuum suction cups / bases

Working Environment: High vacuum (≤1e-7 Torr), high temperature (≤875°C) inside the chamber

Material: Aluminum alloy + stainless steel + ceramic insulation, corrosion-resistant, low particle

Core Functions

Wafer Loading and Unloading: Lift the wafer after the chamber process is completed to facilitate the vacuum manipulator to pick up the wafer; After inserting a new wafer, lower it to its base.

Precise Positioning: Elevation travel range ±0.1mm, ensuring the wafer is parallelly aligned with the base / electrodes to guarantee uniformity of the film.

Vacuum Sealing: The lifting rod is sealed with a metal corrugated tube, maintaining high vacuum in the chamber and preventing air leakage and contamination.

Process Compatibility: Supports multiple temperature / multiple gas environments, compatible with deposition processes such as oxidation, nitriding, and silicon films.